By Amy Edelen | Phoenix Business Journal
Arizona’s semiconductor industry just got another boost.
The U.S. Department of Commerce and Natcast announced Monday that Arizona will be home to the country’s third flagship CHIPS for America research and development facility, underscoring the state’s growing role in the national semiconductor industry.
The NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility will operate at 8240 S. River Parkway in Arizona State University’s Research Park in Tempe.
Read the full story from the Phoenix Business Journal.
More from Arizona State University
ASU’s place among top-tier research universities is being further cemented by the recent by the National Semiconductor Technology Center’s selection of Arizona as the site of the co-located NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility. To be located at the ASU Research Park, work the new facility will help pave the way for major advances in the U.S. semiconductor ecosystem strengthening the U.S. semiconductor supply chain and accelerate cutting-edge research and development. The Fulton Schools will support the facility through ASU’s Core Research Facilities and state-of-the-art research labs.
See also: ASU selected as home, partner for CHIPS, Electronic Products and Technology, January 6
ASU Research Park named one of nation’s 3 ‘flagship’ R&D facilities for microchips, Arizona Republic, January 6
Arizona State selected as third CHIPS Act facility, 3TV/CBS 5 News – Phoenix, January 6
ASU Research Park to be home to major Chips for America research and development facility, ABC 15 Arizona, January 6
ASU to host state-of-the-art CHIPS for America R&D facility, 12 News-Phoenix, January 6
Arizona, ASU score CHIPS for America flagship semiconductor facility, Phoenix Business Journal, January 6
ASU Research Park named flagship CHIPS R&D facility for U.S., AZ Big Media, January 6
Arizona State selected as third CHIPs Act facility, MSN, January 6
Commerce Dept picks Arizona to host chip packaging research lab, Capacity Media, January 6
Biden-Harris Administration Announces Arizona State University Research Park as Planned Site for Third CHIPS for America R&D Flagship Facility, U.S. Department of Commerce, January 6 (news release)
Biden-Harris Administration Announces Arizona State University Research Park as Planned Site for Third CHIPS for America R&D Flagship Facility, National Semiconductor Technology Center, January 6 (news release)
Arizona and ASU Selected For Flagship Prototyping And Advanced Packaging R&R Facility, Arizona Commerce Authority, January 6 (new release)
Read more in Business Facilities Magazine, HPC Wire, Arizona Senator Mark Kelly Newsroom, The American News, PIC (Photonics Integrated Circuits) Magazine, Semiconductor Industry Association, Construction Review, The Oregonian, Yahoo! News.
