By InBusiness PHX
Taiwan Semiconductor Manufacturing Company and Amkor Technology, Inc. announced a 10-year agreement to foster a strong partnership that will enhance advanced semiconductor packaging capabilities in Arizona, strengthening and accelerating investment in the U.S. semiconductor supply chain ecosystem.
The agreement establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services. By working together as partners to expand capacity, the companies aim to enable a more efficient, mutually beneficial operating model while strengthening their ability to support customers’ evolving requirements.
As demand accelerates for high-performance computing, artificial intelligence, and advanced electronics, advanced packaging has become a critical enabler of system-level performance and integration. Through this collaboration, the advanced semiconductor packaging capacity will increase in the region, achieving faster time to market for end customers.
