Photo via TSMC Press Release
By InBusiness Phoenix
Taiwan Semiconductor Manufacturing Company and Amkor Technology, Inc. announced a 10-year agreement to foster a strong partnership that will enhance advanced semiconductor packaging capabilities in Arizona, strengthening and accelerating investment in the U.S. semiconductor supply chain ecosystem.
The agreement establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services. By working together as partners to expand capacity, the companies aim to enable a more efficient, mutually beneficial operating model while strengthening their ability to support customers’ evolving requirements.
As demand accelerates for high-performance computing, artificial intelligence, and advanced electronics, advanced packaging has become a critical enabler of system-level performance and integration. Through this collaboration, the advanced semiconductor packaging capacity will increase in the region, achieving faster time to market for end customers.
“We are pleased to enter into this Agreement with our partner Amkor,” said Kevin Zhang, senior vice president and deputy Co-COO of TSMC. “We have a long history of experience working with Amkor globally in advanced packaging, and we are confident that our collaboration in the United States will be successful as we look to enhance our capabilities to jointly serve our customers.”
The collaboration is expected to enable a more integrated and resilient semiconductor supply chain that benefits customers across a broad range of end markets.
